The humiditi precautions often seen with SMD components are not becuase they are sensitive to moisture during thei operation in whatever product they are installed.
I thas to do with the soldering process. The epoxy encapsulant used to make their cases can absorb moisture. When the circuit boards being assembled (by robots) go through the soldering process, it involves going throuh ovens which melt he solder paste, soldering those components to the circuit board.
These ovens heat up everything (the SMD components and the circuit board) to the solder-melting temperature for a prolonged period of time. Since that temperature is much higher than water boiling temperature, the water absorbed by the resin quickly expands, turning into steam. This can fracture the epoxy resin. Those hairline cracks can late allow moisture, oxygen, or other chemicals to penetrate down to the actual electronic component, shortening its life.
When you get those SMD components packed in airtight bags, they usually include a business-card size moisture indicator and instructions on how to slowly bake those components if the indicator shows that they were exposed to moisture. he slow baking process (before running them through soldering ovens) will slowly evacuate the moisture from the epoxy encapsulant, preventing cracking during soldering.
When you hand solder these, the process only lasts few seconds and only the leads are heated. Rest of the component never gets hot enough to cause stress cracks. So I would say that humid air is not something you need to worry about. But as others have said, the cheap inferior Chinese tantalum caps are quite prone to self-destruct.